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Vol.
25 No. 1
January - February 2003
Where
2B &Y |
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Announcements
of conferences, symposia, workshops, meetings, and other
upcoming activities. |
16th
International Symposium on Plasma Chemistry
- IUPAC-sponsored event*
2227 June 2003, Taormina,
Italy
ISPC is a biennial international
conference with topics encompassing the whole area of plasma
chemistry. The aim of the symposium is to present the recent
progress in plasma chemistry and its applications. The symposium
will be organized into plenary lectures, parallel oral sessions
(invited and contributed presentations), and poster sessions.
The whole area of plasma processing will be covered, from
thermal to non-equilibrium plasmas, and from fundamentals
to applications and engineering. In particular, the following
sessions are being planned:
- fundamentals of plasma-surface
interactions
- gas-phase plasma diagnostics
- modelling in plasma chemistry
- non-equilibrium effects
in plasma chemistry
- plasma sources
- plasma processing for
microelectronics
- PECVD/treatment of semi-conductors
and related materials
- plasma deposition of inorganic
and hard coatings
- plasma deposition and
treatment of polymers
- clusters, particles, and
powders
- plasma chemical synthesis
- plasma spray and thermal
plasma material processing
- hybrid plasma/radiation
processes
Contributions are solicited
in application areas such as biomaterials, waste treatment,
barrier and protective coatings, dielectric barrier discharges,
plasma welding, microelectronics, hard coatings, ophthalmics,
tribology, and others.
The symposium will also include
a plasma equipment exhibition and will be preceded by two
IUPAC summer schools. The IUPAC Summer Schools on Plasma Chemistry,
to be held 1820 June 2003, are addressed to graduate
students, scientists, technical staff, and managers interested
in an updated view of modern plasma applications. The schools
are as follows:
Thermal Plasma Processing
of Materials (Chaired by Professor P. Fauchais, University
of Limoges, France), which will cover the following: introduction,
overview of industrial plasma processes, thermal plasma thermodynamic
and transport properties, plasma generation, plasma characterization,
plasma as a processing medium (interaction with a gas, interaction
with a condensed material, and interaction with a dispersed
medium).
Cold Plasma Processing of
Materials (Chaired by Professor R. dAgostino, University
of Bari, Italy), which will cover the following: fundamentals,
plasma chemistry of deposition treatment and etching processes,
reactor architecture, properties of PECVD coatings and plasma
treated surfaces, plasma diagnostics, surface diagnostics,
applications of plasma processed materials.
One additional School on Plasma
Processes for Microelectronics (Chaired by Professor F. Fracassi,
University of Bari, Italy) will also be organized prior to
the symposium. This course will cover the most important issues
related to dry etching and plasma enhanced chemical vapor
deposition, with particular consideration of new and envisaged
processes utilized in semiconductor manufacturing. The school
is particularly suggested for process engineers, technical
staff, and managers in microelectronics.
See
Calendar for contact information
www.ispc16.org
*
Sponsorship by IUPAC attests to the quality of the scientific
program and indicates the host country's assurance that scientists
from all countries may participate.
> Sponsorship Information
Page
last modified 21 December 2002.
Copyright © 2002 International Union of Pure and Applied
Chemistry.
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